CALL FOR PAPERS
ISQED 2006, 7th International Symposium on
QUALITY ELECTRONIC DESIGN
March 27-29, 2006. San Jose, CA, USA
http://www.isqed.org
ISQED is the pioneer and leading international conference dealing with the
design for manufacturability and quality issues front-to-back. ISQED
spans
three days, Monday through Wednesday, in three parallel tracks, hosting
near
100 technical presentations, six keynote speakers, two-three panel
discussions, workshops /tutorials and other informal meetings. Conference
proceedings are published by IEEE Computer Society and hosted in the
digital
library. Proceedings CD ROMs are published by ACM. In addition,
continuing
the tradition of reaching a wider reader****p in the IC design community,
ISQED will continue to publish special issues in leading journals. The
authors of high quality papers will be invited to submit an extended
version
of their papers for the special journal issues.
Papers are requested in the following areas
===========================================
A pioneer and leading multidisciplinary conference, ISQED accepts and
promotes papers related to the design and manufacturing of quality-based
integrated circuits and systems, from design concept to production and all
key steps between. Authors are invited to submit papers in the various
disciplines of high level design, circuit design, test & verification,
design automation tools; processes; and flows, device modeling,
semiconductor technology, and advance packaging. Authors are further
encouraged to highlight the link between their subject of interest to the
overall design flow chain and address the design quality aspects of the
subject (e.g.,. performance, power, yield, reliability, manufacturability,
time to market , and environmental considerations, etc.).
Design for Manufacturability & Quality (DFMQ)
=============================================
Analysis, modeling, and abstraction of manufacturing process parameters
and
effects for highly predictable silicon performance. Design and synthesis
of
high complexity ICs: signal integrity, transmission line effects, OPC,
phase ****fting, and sub-wavelength lithography, manufacturing yield and
technology capability. Design for diagnosability, defect detection and
tolerance; self-diagnosis, calibration and repair. Design and
manufacturabilty issues for Digital, analog, mixed signal, RF, MEMS,
opto-electronic, biochemical-electronic, and nanotechnology based ICs.
Redundency and other yield improving techniques. Design quality
definitions
and standards; design quality metrics to track and assess the quality of
electronic circuit design, as well as the quality of the design process
itself; design quality assurance techniques. Global, social, and economic
implications of design quality. Design metrics, methodologies and flows
for
custom, semi-custom, ASIC, FPGA, RF, memory, networking circuit, etc. with
emphasis on quality. Design metrics and quality standards for SoC, and
SiP.
Package - Design Interactions & Co-Design (PDI)
================================================
Concurrent circuit and package design and effect on quality. Packaging
electrical and thermal modeling and simulation for improved quality of
product. SoC versus system in a package (SiP): design and technology
solutions and tradeoffs; MCM and other packaging techniques; heat sink
technology.
Design Verification and Design for Testability (DVFT)
=====================================================
Hardware and Software, formal and simulation based design verification
techniques to ensure the functional correctness of hardware early in the
design cycle. DFT and BIST for digital and SoC. DFT for
analog/mixed-signal
ICs and systems-on-chip, DFT/BIST for memories. Test synthesis and
synthesis for testability. DFT economics, DFT case studies. DFT and ATE.
Fault diagnosis, IDDQ test, novel test methods, effectiveness of test
methods, fault models and ATPG, and DPPM prediction. SoC/IP testing
strategies.
Robust Device, Interconnect, and Circuits (RDIC)
================================================
Device, substrate, interconnect, circuit , and IP block modeling and
simulation techniques; quality metrics, model order reduction; CMOS,
Bipolar, and SiGe HBTs device modeling in the context of advanced digital,
RF and high-speed circuits. Modeling and simulation of novel device and
interconnect concepts. Signal integrity analysis: coupling, inductive and
charge sharing noise; noise avoidance techniques. Power grid design,
analysis and optimization; timing analysis and optimization; thermal
analysis and design techniques for thermal management. Modeling
statistical
process variations to improve design margin and robustness, use of
statistical circuit simulators. Power-conscious design methodologies and
tools; low power devices, circuits and systems; power-aware computing and
communication; system-level power optimization and management. Design
techniques for leakage current management.
EDA Methodologies, Tools, & IP Cores; Interoperability and Reuse(EDA)
======================================================================
EDA tools addressing design quality. Management of design process, design
flows and design databases. EDA tools interoperability issues and
implications. Effect of emerging technologies, processes & devices on
design
flows, tools, and tool interoperability. Emerging EDA standards. EDA
design
methodologies and tools that address issues which impact the quality of
the
realization of designs into physical integrated circuits. IP modeling and
abstraction. Design and maintenance of technology independent hard and
soft
IP blocks. Methods and tools for analysis, comparison and qualification of
libraries and hard IP blocks. Challenges and solutions of the integration,
testing, and qualifying of IP blocks from multiple vendors. Third party
testing of IP blocks. Risk management of IP reuse. IP authoring tools and
methodologies.
Physical Design, Methodologies & Tools (PDM)
============================================
Physical synthesis flows for correct-by-construction quality silicon,
implementation of large SoC designs. Tool frameworks and datamodels for
tightly integrated incremental synthesis, placement, routing, timing
analysis and verification. Placement, optimization, and routing
techniques
for noise sensitivity reduction and fixing. Algorithms and flows for
harnessing crosstalk-delay during physical synthesis. Tool flows and
techniques for antenna rule and electromigration rule avoidance and
fixing.
Spare-cell strategies for ECO, decoupling capacitance and antenna rule
fixing. Planning tools for predictable high-current, low-voltage power
distribution. Reliable clock tree generation and clock distribution
methodologies for Gigahertz designs. EDA tools, design techniques, and
methodologies, dealing with issues such as: timing closure, R, L, C
extraction, ground/Vdd bounce, signal noise/cross-talk /substrate noise,
voltage drop, power rail integrity, electromigration, hot carriers,
EOS/ESD,
plasma induced damage and other yield limiting effects, high frequency
effects, thermal effects, power estimation, EMI/EMC, proximity correction
&
phase ****ft methods, verification (layout, circuit, function, etc.).
Effects of Technology on IC Design, Performance, Reliability, and Yield
(TRD)
==============================================================================
Effect of emerging processes & devices on design's time to market, yield,
reliability, and quality. Emerging issues in DSM CMOS: e.g. sub-threshold
leakage, gate leakage, technology road mapping and technology
extrapolation
techniques. New and novel technologies such as SOI,
Double-Gate(DG)-MOSFET,
Gate-All-Around (GAA)-MOSFET, Vertical-MOSFET, strained CMOS,
high-bandwidth
metallization, etc. Challenges of mixed-signal design in digital CMOS or
BiCMOS technology, including issues of substrate coupling, cross-talk and
power supply noise. Significance of reliability effects such as gate
oxide
integrity, electromigration, ESD, etc., in relation to electronic
design.
Impacts of process technologies on circuit design and capabilities (e.g.
low-Vt transistors versus increased off-state leakages) and the accuracy,
use and implementation of SPICE models that faithfully reflect process
technologies. Successful applications of TCAD to circuit design.
System-level Design, Methodologies & Tools (SDM)
================================================
Global, Social, and Economical Implications of Electronic System and
Design
Quality. Emerging standards and regulations influencing system quality.
Emerging system-level design paradigms, methods and tools aiming at
quality.
System-level design process and flow management. System-level design
modeling, analysis and synthesis, estimation and verification for correct
high-quality hardware/software systems. Responsive, secure, and defect
tolerant systems. New concepts, methods and tools addressing system-level
design complexity and multitude of aspects. Methods and tools addressing
the
usage of technology information and manufacturing feedback in the system-,
RTL- and logic level design. The influence of the nanometer technologies'
(application-dependent) yield and other issues on the system-, RTL- and
logic-level design. System-level trade-off analysis and multi-objective
(yield, power, delay, area .) optimization. Effective and efficient
design,
implementation, analysis and validation of large SoCs integrating IP
blocks
from multiple vendors.
Submission of Papers
====================
Paper submission must be done on-line via the conference web site at
www.isqed.org. Authors should submit FULL-LENGTH, original, unpublished
papers (Minimum 4, maximum 6 pages) along with an abstract of about 200
words. Please check the as-printed appearance of your paper before
uploading. To permit a blind review, do not include name(s) or
affiliation(s) of the author(s) on the manuscript and abstract. The
complete contact author information needs to be entered separately. When
ready to submit your paper have the following information ready:
I Title of the paper
II Name, affiliation, complete mailing address and phone, fax, and email
of
the first author
III Name, affiliations, city, state, country of additional authors
IV Person to whom correspondence should be sent, if other than the 1st
author
V Suggested area (as listed above)
The guidelines for the final paper format are provided on the conference
web
site at www.isqed.org. Authors of the submitted papers must register and
attend the conference for their paper to be published. Please note the
following im****tant dates:
Paper Submission Deadline
October 26, 2005
Acceptance Notifications
November 1, 2005
Final Camera-Ready paper
Janurary 3, 2006
About ISQED
===========
The International Symposium on Quality Electronic Design (ISQED), is a
premier Design & Design Automation conference, aimed at bridging the gap
between and integration of, electronic design tools and processes,
integrated circuit technologies, processes & manufacturing, to achieve
design quality. ISQED is the pioneer and leading conference dealing with
design for manufacturability and quality issues front-to-back. The
conference provides a forum to present and exchange ideas and to promote
the
research, development, and application of design techniques & methods,
design processes, and EDA design methodologies and tools that address
issues
which impact the quality of the realization of designs into physical
integrated circuits. The conference attendees are primarily designers of
the
VLSI circuits & systems (IP & SoC), those involved in the research,
development, and application of EDA/CAD Tools & design flows,
process/device
technologists, and semiconductor manufacturing specialists including
equipment vendors. ISQED emphasizes a holistic approach toward design
quality and intends to highlight and accelerate cooperation among the IC
Design, EDA, Semiconductor Process Technology and Manufacturing
communities.
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